Modeling and Simulation of a Nanofluid-Cooled Microchannel Sawtooth Cooling Device
DOI:
https://doi.org/10.3329/dujs.v74i1.84622Keywords:
Microchannel sawtooth cooling device, microchannel heat sink, NanofluidsAbstract
The purpose of this paper is to numerically investigate the heat transfer and pressure drop characteristics of a microchannel sawtooth cooling device for Al₂O₃-water, CuO-water, and TiO₂-water nanofluid coolants. Results are compared with rectangular single-layer microchannel heat sinks (SL-MCHS) and double-layer microchannel heat sinks (DL-MCHS) of the same geometrical features. Numerical simulation has been carried out by the commercial software FLUENT 14.5 release. Governing equations are solved by the finite volume method. The pressure-velocity coupling equation is solved using the Semi-Implicit Method for Pressure Linked Equations (SIMPLE) algorithm. The thermal resistance of the microchannel sawtooth cooling device is lower than SL-MCHS and DL-MCHS. Thermal resistance of the heat sink is influenced by the volume fraction of nanoparticles, geometrical parameters, and pumping power.
Dhaka Univ. J. Sci. 74(1): 62-68, 2026 (January)
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